Title:
SILVER PASTE FOR RESIN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/051831
Kind Code:
A1
Abstract:
Provided is a silver paste for a resin substrate with which a conductive film having a lower resistance in comparison to prior art can be formed, at a low temperature and with good adhesion, on a resin substrate having low thermal resistance. This silver paste for a resin substrate includes a silver powder (A), a binder (B), and a solvent (C) capable of dissolving the binder. The silver powder (A) has an average particle diameter of 40 nm to 100 nm. The binder (B) includes a thermoplastic polyester urethane resin (B1) and a thermoplastic polyester resin (B2), both of which have a glass transition point of 60°C to 90°C. Moreover, the total ratio of the thermoplastic polyester urethane resin (B1) and the thermoplastic polyester resin (B2) included is 3 to 6 parts by mass relative to 100 parts by mass of the silver powder (A).
Inventors:
NAKAYAMA KAZUTAKA (JP)
BABA TATSUYA (JP)
SUMIDA SAHOKO (JP)
BABA TATSUYA (JP)
SUMIDA SAHOKO (JP)
Application Number:
PCT/JP2017/031812
Publication Date:
March 22, 2018
Filing Date:
September 04, 2017
Export Citation:
Assignee:
NORITAKE CO LTD (JP)
International Classes:
H01B1/22; B22F1/054; B22F1/102; B22F1/12; B22F1/16; B22F9/26; B22F9/30; C09D167/00; C09D175/06; H01B1/00; H05K1/09
Domestic Patent References:
| WO2015046096A1 | 2015-04-02 |
Foreign References:
| JP2015069877A | 2015-04-13 | |||
| JP2009144197A | 2009-07-02 | |||
| JP2003203523A | 2003-07-18 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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