SOLDERING FLUX, CREAM SOLDER, SOLDERING METHOD, FOOD CONTAINER, AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2007/034758

A1

[PROBLEMS] To provide a flux wherein a flux residue formed after soldering can be removed readily by washing with water and the waste liquid can be biodegraded readily in the natural environment and which is harmless to a human or animal body, a cream solder which causes little air pollution by lead, a soldering method and others. [MEANS FOR SOLVING PROBLEMS] A soldering flux comprising (A) water, (B) (b1) a reductive organic compound or phenolic anti-oxidative agent which is soluble in water, can be biodegraded readily and is composed of a carbon atom, a hydrogen atom and an oxygen atom, or (b-2) an alkaline metal salt of a reductive organic acid which is soluble in water, can be biodegraded readily and is composed of a carbon atom, a hydrogen atom and an oxygen atom and (C) a thixotropic agent which is soluble in water and can be biodegraded readily; a cream solder comprising the soldering flux and (D) a lead-free solder particle; and a soldering method using the cream solder.

YAMAKAWA KIMIO (JP)
MINE KATSUTOSHI (JP)

PCT/JP2006/318421

March 29, 2007

September 15, 2006

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NIHON HANDA CO LTD (JP)
YAMAKAWA KIMIO (JP)
MINE KATSUTOSHI (JP)

B23K35/363

JPH11267885A	1999-10-05
JP2005074484A	2005-03-24
JPH11267879A	1999-10-05
JPH09192882A	1997-07-29
JPH0788686A	1995-04-04
JPH08257790A	1996-10-08
JPH0386389A	1991-04-11
JPH07290278A	1995-11-07

KUBOTA, Yoshitaka (2-15 Yayoi-cho, Inage-ku, Chiba-sh, Chiba 22, JP)

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