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Patent Searching and Data


Title:
STARTING LIQUID FOR FORMING PROTECTIVE FILM, PROTECTIVE FILM, AND WIRED SUBSTRATE HAVING PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2010/095738
Kind Code:
A1
Abstract:
Provided is a protective film that is highly adhesive. Also provided is the starting liquid for obtaining this protective film. The starting liquid comprises a polyimide resin component containing a polyimide resin represented by chemical formula (1), a photosensitizer, and a block isocyanate. The starting liquid is applied to the surface of an object to be coated on which a metal wiring film (12) has been disposed and the solvent is evaporated by drying in order to form a photopolymerizable film for covering the metal wiring film (12) on the object to be coated prior to the formation of a protective film on a wired substrate (10); the photopolymerizable film is partially removed by exposure and development; the product is cured by heating; and the metal wiring film (12) is partially exposed while a protective film (13) that covers the rest is formed to obtain the wired substrate (10). Crosslinking is performed after patterning and adhesion with the metal film is therefore high. (1) (In formula (1), R1 and R2 are each independently optionally substituted alkylene groups, m is an integer between 1 and 30, and n is an integer between 0 and 20.)

Inventors:
KANAYA HIROKI (JP)
SUNAGA TOMOYASU (JP)
NOMURA MAMIKO (JP)
ISHII JUNICHI (JP)
Application Number:
PCT/JP2010/052626
Publication Date:
August 26, 2010
Filing Date:
February 22, 2010
Export Citation:
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Assignee:
SONY CHEM & INF DEVICE CORP (JP)
KANAYA HIROKI (JP)
SUNAGA TOMOYASU (JP)
NOMURA MAMIKO (JP)
ISHII JUNICHI (JP)
International Classes:
C08G18/80; C08G18/64; C08L79/08; G03F7/004; G03F7/023; H05K3/28
Foreign References:
JP2003335858A2003-11-28
US3682860A1972-08-08
JPH07318701A1995-12-08
JPH06271673A1994-09-27
JPH04325523A1992-11-13
GB1309501A1973-03-14
Attorney, Agent or Firm:
ISHIJIMA, Shigeo et al. (JP)
Shigeo Ishijima (JP)
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