Title:
STRUCTURE FOR COOLING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2008/153172
Kind Code:
A1
Abstract:
A structure for cooling a semiconductor element includes a plurality of semiconductor
elements (1A-1D), and electrode structure (2), which has cooling medium channels
(20A, 20B) inside and is electrically connected to the plurality of semiconductor
elements (1). The electrode structure (2) includes an alternating current
electrode (2A) having the semiconductor elements (1) mounted on the both surfaces,
and a plurality of direct current electrodes (2B), which sandwich the alternating
current electrode (2A) and the semiconductor elements (1A-1D) respectively
mounted on the both surfaces of the alternating current electrode (2A). Each
of the alternating current electrode (2A) and the direct current electrodes
(2B) has the cooling medium channels (20A, 20B) inside.
Inventors:
YOSHIDA TADAFUMI (JP)
OSADA HIROSHI (JP)
YOKOI YUTAKA (JP)
YAMADA YASUSHI (JP)
OSADA HIROSHI (JP)
YOKOI YUTAKA (JP)
YAMADA YASUSHI (JP)
Application Number:
PCT/JP2008/060936
Publication Date:
December 18, 2008
Filing Date:
June 10, 2008
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
YOSHIDA TADAFUMI (JP)
OSADA HIROSHI (JP)
YOKOI YUTAKA (JP)
YAMADA YASUSHI (JP)
YOSHIDA TADAFUMI (JP)
OSADA HIROSHI (JP)
YOKOI YUTAKA (JP)
YAMADA YASUSHI (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H02M1/00; H05K7/20
Foreign References:
| JP2007215396A | 2007-08-23 | |||
| JPS61248455A | 1986-11-05 | |||
| JP2005057130A | 2005-03-03 |
Attorney, Agent or Firm:
FUKAMI, Hisao et al. (Nakanoshima Central Tower 22nd Floor,2-7, Nakanoshima 2-chome,Kita-ku, Osaka-sh, Osaka 05, JP)
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