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Patent Searching and Data


Title:
SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/067709
Kind Code:
A1
Abstract:
[Problem] To provide a substrate inspection device and substrate inspection method that facilitate the reduction of the man-hours required to measure capacitance and resistance. [Solution] A substrate inspection device is provided with a measurement processing unit 41 that corresponds to a plurality of combinations obtained by combining each of a plurality of connection terminals Tx and a plurality of connection terminals Ty with each other and carries out measurement processing for obtaining currents corresponding to each combination by, for each of the connection terminals Tx, Ty corresponding to a combination, using an AC power supply 2 to provide an AC signal SA to the connection terminal Ty of the combination and using an ammeter 3 to detect the current flowing through the terminal Tx of the combination and with a calculation unit 42 that calculates the capacitance and resistance corresponding to each combination on the basis of information indicating the sizes and phases of the currents detected by the ammeter 3 in the measurement processing.

Inventors:
TAKAHASHI TADASHI (JP)
HIBARINO TOSHIHISA (JP)
HONDA MUTSUHIRO (JP)
Application Number:
PCT/JP2015/072558
Publication Date:
May 06, 2016
Filing Date:
August 07, 2015
Export Citation:
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Assignee:
NIDEC READ CORP (JP)
International Classes:
G01R31/00; G01R27/02; G01R27/26; G06F3/041; G06F3/044
Domestic Patent References:
WO2011121862A12011-10-06
Foreign References:
JP2012122989A2012-06-28
JPH0346572A1991-02-27
JPH0599788A1993-04-23
JP2013088510A2013-05-13
JPS60216493A1985-10-29
JP2014238318A2014-12-18
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
Takao Yanagino (JP)
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