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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE INVERTING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/192662
Kind Code:
A1
Abstract:
The present application relates to a substrate processing device 1 and a substrate transfer method. The substrate processing device 1 is provided with a support unit 25, a transfer mechanism 23, and an inverting mechanism 26. The transfer mechanism 23 is provided with a first suction unit 42 and a hand drive unit 45. The inverting mechanism 26 is provided with a second suction unit 72 and a rotational drive unit. When the transfer mechanism 23 transfers the substrate W to the support unit 25, the first suction unit 42 is positioned over the substrate W, the first suction unit 42 flows a gas along an upper surface of the substrate W and suctions the substrate W upward, and the hand drive unit 45 moves the first suction unit 42 to the support unit 25. When the inverting mechanism 26 receives the substrate W from the support unit 25, the second suction unit 72 is positioned over the substrate W being supported by the support unit 25, and the second suction unit 72 flows a gas along the upper surface of the substrate W and suctions the substrate W upward.

Inventors:
TAKAYAMA YUICHI (JP)
Application Number:
PCT/JP2021/004587
Publication Date:
September 30, 2021
Filing Date:
February 08, 2021
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/677
Foreign References:
JP2009071235A2009-04-02
JP2018111146A2018-07-19
JP2019129246A2019-08-01
JP2016186987A2016-10-27
JP2017092228A2017-05-25
JP2009088304A2009-04-23
JP2008270626A2008-11-06
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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