Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/047723
Kind Code:
A1
Abstract:
Provided is a substrate processing method for processing a substrate which has a first main surface that has a first peripheral part, a second main surface that is on the opposite side from the first main surface and that has a second peripheral part, and an outer peripheral end that joins the first peripheral part and the second peripheral part. The substrate processing method comprises: a protective film formation step for supplying a protective film forming solution to the first main surface so as to form a protective film on the first peripheral part; a first chemical solution supply step for supplying a chemical solution to the second main surface in a state in which the protective film is formed on the first peripheral part, and causing the chemical solution to reach the outer peripheral end so as to process the outer peripheral end with the chemical solution; and a protective film removal step for removing the protective film after the first chemical solution supply step.
Inventors:
INABA MASAKI (JP)
UMEDA EIJI (JP)
UMEDA EIJI (JP)
Application Number:
PCT/JP2022/024512
Publication Date:
March 30, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306; H01L21/304
Foreign References:
| JP2006073577A | 2006-03-16 | |||
| JP2001319910A | 2001-11-16 | |||
| JP2015000356A | 2015-01-05 | |||
| JP2020013911A | 2020-01-23 | |||
| JP2005064325A | 2005-03-10 | |||
| JP2017098333A | 2017-06-01 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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