Title:
SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND PROCESSING LIQUID
Document Type and Number:
WIPO Patent Application WO/2023/047724
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing method, a substrate processing apparatus, and a processing liquid. This substrate processing method comprises a processing liquid supply step, a solidified film formation step and a sublimation step. In the processing liquid supply step, a processing liquid is supplied to a substrate. The processing liquid contains a sublimable substance and a solvent. In the solidified film formation step, the solvent is evaporated from the processing liquid on the substrate. In the solidified film formation step, a solidified film is formed on the substrate. The solidified film contains the sublimable substance. In the sublimation step, the solidified film is sublimated. The substrate is dried by means of the sublimation of the solidified film. Meanwhile, the sublimable substance is 4-nitrotoluene.
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Inventors:
HANAWA YOSUKE (JP)
SASAKI YUTA (JP)
KUNIEDA SHOGO (JP)
SASAKI YUTA (JP)
KUNIEDA SHOGO (JP)
Application Number:
PCT/JP2022/024527
Publication Date:
March 30, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2017025210A | 2017-02-02 | |||
| JP2021009988A | 2021-01-28 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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