Title:
SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2020/084944
Kind Code:
A1
Abstract:
The present invention provides a technology for suitably performing etching treatment of a substrate. A substrate holding stage 20 holds a substrate W at a predetermined position. An etching solution supply unit 37 and a nozzle 30 supply an etching solution to the substrate W at the predetermined position. A spin motor 22 rotates the substrate holding stage 20 around a predetermined rotation axis Ax1. A thermography camera 70 acquires a thermography (temperature distribution) of a peripheral area PA1 around a substrate area which the substrate W occupies when being disposed at the predetermined position in a treatment space TS1 inside a chamber 10. A feature value calculation unit 902 calculates, from the thermography, a feature value relating to the amount of etching by etching treatment using the etching solution. An etching determination unit 9031 determines the propriety of the etching treatment on the basis of the calculated feature value.
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Inventors:
INOUE MASAFUMI (JP)
FUKATSU EIJI (JP)
FUKATSU EIJI (JP)
Application Number:
PCT/JP2019/035767
Publication Date:
April 30, 2020
Filing Date:
September 11, 2019
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| WO2018110301A1 | 2018-06-21 | |||
| WO2015037035A1 | 2015-03-19 |
Foreign References:
| JP2016015395A | 2016-01-28 | |||
| JPH04348513A | 1992-12-03 | |||
| JP2009231732A | 2009-10-08 | |||
| JP2007335709A | 2007-12-27 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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