Title:
TEMPORARY FIXING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/157128
Kind Code:
A1
Abstract:
Provided is a temporary fixing material that exhibits: temporary fixing properties that make it possible to easily and temporarily fix into place and detach precision electronic components that are made of glass, metal, or the like; foreign matter removal properties that make it possible to remove foreign matter that has adhered to an adherend prior to temporary fixing; and antistatic properties that remove static electricity that is generated when detaching. The temporary fixing material comprises a base material and a polymer gel, is applicable to the temporary fixing of electronic components during the conveyance thereof, and comprises a polymer gel in which water having at least a polyvinyl alcohol polymer dissolved therein is held within a polymer matrix in which a polymerizable monomer having one polymerizable carbon-carbon double bond in the molecule thereof and a cross-linkable monomer having two or more polymerizable carbon-carbon double bonds in the molecule thereof are copolymerized and cross-linked.
Inventors:
FUJIWARA YASUHIRO (JP)
KATO KAZUKI (JP)
KATO KAZUKI (JP)
Application Number:
PCT/JP2014/058164
Publication Date:
October 02, 2014
Filing Date:
March 25, 2014
Export Citation:
Assignee:
SEKISUI PLASTICS (JP)
International Classes:
C09J7/20; C08L29/04; C08L101/00; C09J9/00; C09J129/04; C09J157/00
Foreign References:
| JP2003096431A | 2003-04-03 | |||
| JP2000503009A | 2000-03-14 | |||
| JP2004292592A | 2004-10-21 | |||
| JP2012072262A | 2012-04-12 | |||
| JP2001181597A | 2001-07-03 |
Attorney, Agent or Firm:
OHTAKE, Seigo et al. (JP)
Shogo Otake (JP)
Shogo Otake (JP)
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