Title:
TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTION METHOD THEREFOR, LEAD FRAME WITH TEMPORARY PROTECTION FILM, TEMPORARILY PROTECTED ENCAPSULATION OBJECT, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/206069
Kind Code:
A1
Abstract:
A temporary protection film for semiconductor encapsulation which comprises a substrate film and an adhesive layer. The adhesive layer comprises a thermoplastic resin and a low-molecular-weight additive having a molecular weight less than 1,000. The adhesive layer has been configured so that when the temporary protection film for semiconductor encapsulation is applied to a surface of a copper sheet with the adhesive layer in contact with the copper sheet to form a laminate consisting of the copper sheet and the temporary protection film for semiconductor encapsulation and the laminate is subsequently heated at 180°C for 1 hour, then the surface of the copper sheet has a proportion of oxygen atoms of X1 and when the laminate is thereafter heated at 400°C for 2 minutes, then the surface of the copper sheet has a proportion of oxygen atoms of X2, X2 being less than X1.
More Like This:
Inventors:
KURODA TAKAHIRO (JP)
TOMORI NAOKI (JP)
NAGOYA TOMOHIRO (JP)
TOMORI NAOKI (JP)
NAGOYA TOMOHIRO (JP)
Application Number:
PCT/JP2021/014555
Publication Date:
October 14, 2021
Filing Date:
April 05, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J11/06; C09J201/00; H01L21/56; H01L23/50
Domestic Patent References:
| WO2019176596A1 | 2019-09-19 | |||
| WO2019176597A1 | 2019-09-19 | |||
| WO2018207408A1 | 2018-11-15 |
Foreign References:
| JP2008103700A | 2008-05-01 | |||
| JP2008277802A | 2008-11-13 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: