Title:
WATER SOLUBLE OR WATER DISPERSIBLE HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2001220563
Kind Code:
A
Abstract:
To obtain a water soluble or water dispersible hot melt adhesive composition which is soluble in water, excellent in water dipersibility, low in the melt viscosity and excellent in the adhesiveness, moisture resistance and thermal stability.
The water soluble or water dispersible hot melt adhesive composition contains 100 pts.wt. of (a) a poly(vinyl alcohol)-based resin which has a degree of polymerization of 350 or less and a degree of saponification of 80% or less; 5-100 pts.wt. of (b) mannitol; and 5-100 pts.wt. of (c) a polypropylene glycol which has an average molecular weight of 230-450 and a hydroxy value of 300 or more.
Inventors:
YAMAGUCHI MASASHI
Application Number:
JP2000032077A
Publication Date:
August 14, 2001
Filing Date:
February 09, 2000
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09J129/04; C09J5/06; C09J11/06; (IPC1-7): C09J129/04; C09J5/06; C09J11/06
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