Title:
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2023/162406
Kind Code:
A1
Abstract:
[Problem] To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same surface. [Solution] A thin film capacitor 1 is provided with: metal foil 10 that has an unroughened central section 13 and a roughened upper surface 11; a dielectric film D that covers the roughened upper surface 11 of the metal foil 10; an electrode layer 31 that is in contact with the metal foil 10; an electrode layer 32 that is not in contact with the metal foil 10 and is in contact with the dielectric film D; and an insulation member 21 disposed between the electrode layers 31, 32. The metal foil 10 has a groove 14 that is provided so as to penetrate the surface layer portion of the roughened metal foil 10 and exposes the unroughened central section 13. The insulation member 21 is in contact with the central section 13 of the metal foil 10 that is exposed at the bottom of the groove 14.
Inventors:
HAYAMIZU YOSHIAKI (JP)
ISHII DAIKI (JP)
TOMIKAWA MITSUHIRO (JP)
YOSHIDA KENICHI (JP)
HARADA YASUNORI (JP)
ISHII DAIKI (JP)
TOMIKAWA MITSUHIRO (JP)
YOSHIDA KENICHI (JP)
HARADA YASUNORI (JP)
Application Number:
PCT/JP2022/045458
Publication Date:
August 31, 2023
Filing Date:
December 09, 2022
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33
Domestic Patent References:
| WO2018021001A1 | 2018-02-01 | |||
| WO2022004017A1 | 2022-01-06 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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