THREE-DIMENSIONAL FLEXIBLE ELECTRONIC MODULE

Title:

THREE-DIMENSIONAL FLEXIBLE ELECTRONIC MODULE

Document Type and Number:

WIPO Patent Application WO1999022571

Kind Code:

A3

Abstract:

A three-dimensional flexible electronic module contains a multiplicity of packaged and/or unpackaged electronic components (2, 1) and/or micro-plates (3) carrying the unpackaged electronic components electrically connected by commutation plates in the form of corrugated flexible printed boards (8) with alternating widened and narrowed sections and active and passive electronic components (4, 5). The entire construction is placed in a flexible envelope (9) and heat is removed from the electronic, passive and active components through a heat sink (15). The module can contain different transducers and receiver-transmitter systems. Unpackaged electronic components, packaged electronic components and microboards (1, 2, 3) besides interconnections are electrically connected one to another by the means of flexible corrugated commutation boards (8) having variable cross-section. The module can be compressed and strained, and bended in every direction.

Inventors:

SASOV JURY DMITRIEVICH (RU)

Application Number:

PCT/RU1998/000360

Publication Date:

December 02, 1999

Filing Date:

November 03, 1998

Export Citation:

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Assignee:

AMTEKH INTERNATIONAL INC R (US)
SASOV JURY DMITRIEVICH (RU)

International Classes:

H01L23/538; H01L25/065; H05K3/36; H05K1/14; H05K1/18; H05K7/20; (IPC1-7): H05K1/14; H05K7/20

Foreign References:

FR2640108A1	1990-06-08
DE3330466A1	1984-03-08
US3766439A	1973-10-16
DE3536963A1	1987-04-23
US4149219A	1979-04-10
US4599680A	1986-07-08
GB2102590A	1983-02-02
DE3321320C2	1989-07-27

Other References:

DATABASE WPI Derwent World Patents Index;
PATENT ABSTRACTS OF JAPAN

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