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Title:
THREE-DIMENSIONAL ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO1999022570
Kind Code:
A3
Abstract:
The present invention relates to the conception of three-dimensional modules using naked three-dimension or film-type electronic components. Independent electronic components are formed on the base of IC crystals while micro-boards are used for supporting passive and active electronic components, wherein multi-functional-purpose intermediate boards are mounted between said independent components and micro-boards. All constitutive parts of the module are essentially made of thermally conductive materials and form, together with the members of the heat sink provided inside said module, an efficient heat-dispersion assembly. The micro-boards and the intermediate boards further include film-type active and passive components which are realised according to the semi-conductor, thin-layer or thick-layer techniques. This system is used for substantially increasing the operation capacity of an apparatus. This invention also relates to a module universal structure which can be used in many electronic devices with various purposes. The structure allows this module to be used in severe exploitation conditions and increases the packaging density up to the present industrial limits. This invention also relates to variants for economically and efficiently assembling this module using capillary soldering or resilient members.

Inventors:
SASOV JURY DMITRIEVICH (RU)
Application Number:
PCT/RU1998/000359
Publication Date:
October 07, 1999
Filing Date:
November 03, 1998
Export Citation:
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Assignee:
AMTECH R INT INC (US)
SASOV JURY DMITRIEVICH (RU)
International Classes:
H01L25/03; H01L25/10; H05K1/18; H05K7/02; (IPC1-7): H05K7/02; H01L23/538; H01L25/075; H05K1/14
Domestic Patent References:
WO1996000494A11996-01-04
WO1992003035A11992-02-20
Foreign References:
US4956694A1990-09-11
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DE3321320A11983-12-22
DE2514123A11975-10-30
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US5016138A1991-05-14
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GB2127217A1984-04-04
GB2095039A1982-09-22
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