Title:
WAFER CARRYING APPARATUS AND SEMICONDUCTOR PROCESS DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/099369
Kind Code:
A1
Abstract:
The present application discloses a wafer carrying apparatus. The disclosed wafer carrying apparatus comprises a base, a feed portion, and a first adapter. The first adapter is located below the base, and is provided with a central hole and an annular electrical connection surface. The annular electrical connection surface is arranged around the central hole. The end portion of the feed portion is inserted into the central hole and is electrically connected to the first adapter. The base is electrically connected to the annular electrical connection surface. The present application further discloses a semiconductor process device. The solution can solve the problem in the related art of the poor temperature uniformity in the circumferential direction of the wafer carrying apparatus.
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Inventors:
WU DONGYU (CN)
LIU XIAOHANG (CN)
WEI GANG (CN)
LIU XIAOHANG (CN)
WEI GANG (CN)
Application Number:
PCT/CN2023/130514
Publication Date:
May 16, 2024
Filing Date:
November 08, 2023
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01J37/32; H01L21/67
Foreign References:
| CN105580128A | 2016-05-11 | |||
| CN109148251A | 2019-01-04 | |||
| CN114695041A | 2022-07-01 | |||
| US20120091104A1 | 2012-04-19 | |||
| US20060090855A1 | 2006-05-04 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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