Title:
WIRING CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME, AND WIRING CIRCUIT SHEET
Document Type and Number:
WIPO Patent Application WO/2019/230335
Kind Code:
A1
Abstract:
This wiring circuit board is provided with: a support metal layer having a heat conductivity of 5 W/m⋅K or more; an insulation layer arranged on at least one side of the support metal layer in the thickness direction; a wiring layer arranged on the surface of the insulation layer; a protective metal film arranged on the entire surface of the support metal layer between the support metal layer and the insulation layer; and a protective thin film arranged on an exposure surface, of the support metal layer, exposed from the protective metal film.
Inventors:
ITO MASAKI (JP)
SHIBATA NAOKI (JP)
OYABU YASUNARI (JP)
TAKIMOTO KENYA (JP)
SHIBATA NAOKI (JP)
OYABU YASUNARI (JP)
TAKIMOTO KENYA (JP)
Application Number:
PCT/JP2019/018714
Publication Date:
December 05, 2019
Filing Date:
May 10, 2019
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/02; H01L23/36; H05K1/05; H05K3/00
Foreign References:
| JP2007035868A | 2007-02-08 | |||
| JPH06125155A | 1994-05-06 | |||
| JP2014191845A | 2014-10-06 | |||
| JP2004214583A | 2004-07-29 | |||
| JP2003152335A | 2003-05-23 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Download PDF: