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WO/2020/160286A1 |
A multi-modal diamond abrasive package or slurry is disclosed for polishing hard substrates. The multi-modal diamond abrasive package or slurry generally includes a plurality of diamond abrasives. Each one of the diamond abrasives of the...
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WO/2020/145121A1 |
The present invention addresses the problem of providing: a method for regenerating a polishing agent, which can be employed for the polishing of a chemically strengthened glass, and whereby it becomes possible to remove a K2O-containing...
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WO/2020/146161A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising colloidal silica, (b) a compound of formula (I), (c) a compound of formula (II), (d) hydrogen peroxide, and (e) water, wherein the p...
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WO/2020/142354A1 |
A chemical mechanical polishing composition includes a water based liquid carrier, cationic abrasive particles dispersed in the liquid carrier, a first amino acid compound having an isoelectric point of less than 7 and a second amino aci...
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WO/2020/141804A1 |
The present invention provides a chemical-mechanical polishing particle having high polishing quality with a high polishing rate and few defects or scratches by modifying the surface of a polishing particle, and a polishing slurry compos...
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WO/2020/138717A1 |
The present invention relates to a CMP slurry composition for polishing polycrystalline silicon and a polishing method using same. A CMP slurry composition for polishing polycrystalline silicon according to an embodiment of the present i...
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WO/2020/135168A1 |
Disclosed is a chemico-mechanical polishing solution, comprising silica abrasion particles, a nitrogen-containing heterocyclic compound comprising one or more carboxyl groups, and an ethoxylated butoxylated alkyl alcohol. Also disclosed ...
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WO/2020/138737A1 |
The present invention relates to a one-component polishing slurry composition and a polishing method using same and, more specifically, to a one-component polishing slurry composition and a polishing method using same, the one-component ...
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WO/2020/130332A1 |
The present invention relates to a polishing slurry composition. A polishing slurry composition according to one embodiment of the present invention comprises: a nonionic polymer having at least one amide bond; a selectivity control agen...
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WO/2020/131155A1 |
This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydr...
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WO/2020/130251A1 |
The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present invention comprises a polishing solution containing polishing particles; and an additive solution c...
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WO/2020/131153A1 |
This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydr...
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WO/2020/130256A1 |
The present invention relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including ...
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WO/2020/120522A1 |
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP)methods. The presently claimed invention particularly relates to a composition and process for chemical-m...
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WO/2020/120641A1 |
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP) methods. The presently claimed invention particularly relates to a composition and process for chemical-...
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WO/2020/123332A1 |
The invention provides a chemical-mechanical polishing composition comprising(a) an abrasive having a Vickers hardness of 16 GPa or more, and (b) a liquid carrier, wherein the polishing composition is substantially free of an oxidizing a...
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WO/2020/122191A1 |
Provided are: a polishing composition which can be used more suitably in a use application in which a synthetic resin or the like is polished; and a polishing method for polishing an object of interest with a polishing composition. A pol...
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WO/2020/120520A1 |
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP) methods. The presently claimed invention particularly relates to a composition and process for chemical-...
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WO/2020/117441A1 |
A chemical mechanical polishing composition for polishing a substrate having copper, barrier, and dielectric layers includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole...
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WO/2020/117438A1 |
A chemical mechanical polishing composition for polishing a substrate having a cobalt layer includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole compound, wherein the p...
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WO/2020/117440A1 |
The invention provides a chemical mechanical polishing composition for polishing a silicon nitride containing substrate. The composition includes an aqueous carrier; cationic silica particles dispersed in the aqueous carrier, the cationi...
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WO/2020/117439A1 |
A chemical mechanical polishing composition for polishing a substrate includes a liquid carrier and cationic metal oxide abrasive particles dispersed in the liquid carrier. The cationic metal oxide abrasive particles have a surface modif...
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WO/2020/101134A1 |
The present invention relates to a polishing slurry composition and a method for producing same. The polishing slurry composition according to one embodiment of the present invention comprises: polishing particles dispersed so as to have...
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WO/2020/100985A1 |
In one embodiment, there is provided a polishing liquid composition capable of reducing scratching of a substrate surface after polishing while ensuring polishing speed. The present disclosure, in one embodiment, pertains to a polishin...
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WO/2020/100848A1 |
The objective of the invention is to provide a multi-core ferrule polishing material suitable for polishing a multi-core ferrule. The multi-core ferrule polishing material of the present invention for solving the above problem contains...
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WO/2020/091242A1 |
The present invention relates to a slurry composition for CMP comprising: polishing particles; one or more additives selected from the group consisting of a heterocyclic compound, a nitride, a chelating agent, a copper polishing rate enh...
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WO/2020/087721A1 |
The present application provides a chemical-mechanical polishing solution for silicon carbide having increased pH stability. The polishing solution comprises: an oxidant, a high hardness abrasive and a pH stabilizer, the pH stabilizer be...
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WO/2020/081870A1 |
An article includes a package including a packaging material defining an enclosed volume, wherein a desiccant and a bonded abrasive article are contained within the enclosed volume. In an embodiment, the desiccant comprises calcium ions ...
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WO/2020/075654A1 |
The present invention addresses the problem of providing a silica-based particle dispersion which contains a silica-based particle group and with which a high polishing rate and high surface precision can be achieved with respect to a si...
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WO/2020/066671A1 |
Provided are: a polishing pad useful for removing undulations in a curved resin-coated surface at a high polishing rate; and a polishing method using the polishing pad. A polishing pad (10) according to an aspect of the present invention...
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WO/2020/066998A1 |
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The ave...
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WO/2020/067057A1 |
The present invention provides: a polishing composition which enables the achievement of high polishing rate and high surface quality with respect to polishing of a gallium oxide substrate; and a polishing method and a production method ...
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WO/2020/054823A1 |
A polishing pad is provided that can polish a curved surface to be polished on an object to be polished and remove waviness on the curved surface to be polished by way of a polishing surface following curved surfaces having various degre...
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WO/2020/037140A1 |
An abrasive article can include a body including a bond material comprising an inorganic material, abrasive particles and a filler comprising a nitride. The filler comprising a nitride can compensate shrinkage of the body during sinterin...
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WO/2020/033889A1 |
A composition having a plurality of abrasive particles including alumina, the plurality of abrasive particles have mesoporosity with an average meso branching index of at least 55 junctions/microns2 and a median particle size (D50) of at...
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WO/2020/017894A1 |
Provided are a chemical-mechanical polishing composition, a chemical-mechanical polishing slurry, and a method for polishing a substrate, which are capable of implementing a polishing rate equivalent to or higher than that of a conventio...
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WO/2020/008860A1 |
A liquid wax to be applied to runway surfaces in icy or snowy conditions, the wax exhibiting superior runway properties; and a method for manufacturing said liquid wax for runway surfaces, wherein paraffin is dispersed in and mixed with ...
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WO/2020/009054A1 |
The present invention provides a polishing means which is capable of improving the flatness of a substrate without significantly reducing the polishing rate. The present invention specifically provides a polishing composition which conta...
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WO/2019/225194A1 |
Provided is a lubricant capable of improving the property of sliding on ice and snow. Also provided is a fluorocarbon for use in the lubricant for use on ice and snow, characterized in that the lubricant includes a paraffin wax and the f...
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WO/2019/220376A1 |
A scouring article include a three-dimensional non-woven web of fibers bonded to one another to form a lofty, non-woven substrate. An abrasive coating is coated on the substrate. The abrasive coating includes a binder; a first plurality ...
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WO/2019/216205A1 |
Provided is, as one embodiment, a polishing liquid composition for a glass hard disk substrate that can prevent deterioration of surface roughness of a substrate surface after washing while maintaining the polishing rate. One embodiment ...
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WO/2019/204673A1 |
A composition is provided comprising a high viscosity amino functional silicone fluid, a silicone glycol copolymer, an aqueous-based intumescent flame retardant, and an aqueous-based concentrated cationic fluoropolymer system that cures ...
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WO/2019/199073A1 |
Polishing compositions according to various embodiments of the present disclosure comprise a fluorine-containing compound, a pH adjuster, an additive, and water, wherein the content of the fluorine-containing compound may be 0.01-20 wt% ...
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WO/2019/198622A1 |
[Problem] To provide a polishing composition which can polish a substrate on which is formed a silica coating or the like at high speed by increasing the effects of mechanical friction using abrasive grains that produce no defects, which...
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WO/2019/190730A2 |
A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further ...
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WO/2019/189610A1 |
Provided is a polishing composition with which a high polish rate is achieved, surface smoothness (surface quality) of a polishing substrate is improved, and defects can be reduced. Specifically, this polishing composition contains silic...
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WO/2019/190738A1 |
The compositions of the present disclosure polish surfaces or substrates that at least partially include ruthenium. The composition includes a synergistic combination of ammonia and oxygenated halogen compound. The composition may furthe...
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WO/2019/187977A1 |
Provided is a polishing solution which does not easily generate defects on a polishing surface and is capable of more selectively polishing silicon oxide relative to silicon nitride when applied to CMP, or does not easily generate defect...
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WO/2019/187969A1 |
Provided is a polishing composition that, although including a polyvinyl alcohol-based polymer, has suppressed aggregation of the polyvinyl alcohol-based polymer in the composition and can effectively reduce surface defects. This polishi...
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WO/2019/181437A1 |
The purpose of the present invention is to provide a polishing liquid which, when applied to CMP, has a high selectivity of polishing silicon nitride over silicon oxide and which does not tend to cause defects in the polished surface; an...
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