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WO/1996/004347A1 |
A reaction adhesive becomes porous after hardening. This allows both small and larger gaps to be sealed between the bonded substrates, as the liquid adhesive has a low to medium viscosity and the hardened glue shows a marked volume incre...
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WO/1996/000969A1 |
The invention relates to an anisotropically conducting adhesive with particles dispersed in a thermoplastic base material. The particles (20) are finely divided below a percolation threshold and can be deliberately enriched to form aniso...
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WO/1995/031514A1 |
Composite pressure sensitive hydrophilic adhesive, permeable for water vapor and losing its adhesiveness in contact with liquid water, particularly suitable for temporary glueing medical means to the body surface, comprising a gelled mix...
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WO/1995/030720A1 |
A heat-resistant anti-static pressure-sensitive adhesive tape comprising a substrate having coated thereon a microparticulate adhesive having an average diameter of at least 1 micrometer, wherein the microparticles have a surface bearing...
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WO/1995/026385A1 |
Light transparent, visible bubble-free, curable adhesive compositions, their method of manufacture and their use in producing optically brilliant three-dimensional signs for both interior and exterior use are disclosed. The compositions ...
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WO/1995/023416A1 |
The invention concerns an anisotropically conducting adhesive with conducting particles dispersed in a base material. According to the invention, the particles (14) have spacer means (16) on their surfaces.
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WO/1995/020820A1 |
The invention provides a composition (3) comprising: (i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles (5) having...
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WO/1995/017312A1 |
A wall-covering sheet substrate web comprising in sequence a pressure sensitive adhesive layer, substrate layer, decorative surface layer and a release surface. The web is self-wound into a roll by consecutive winding, the adhesive layer...
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WO/1995/016998A1 |
An anisotropic, electrically conductive adhesive film comprises an insulating adhesive, electrically conductive particles dispersed in the electrically insulating adhesive, and transparent, spherical glass particles dispersed in the insu...
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WO/1995/013331A1 |
Pressure sensitive adhesives and tackified pressure sensitive adhesives that are the polymerization product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a Tg less than 0 �C; a non-polar ethylenically unsaturat...
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WO/1995/012643A1 |
An electrically conductive adhesive is described that is made of a porous substrate having numerous passages extending through it. The walls of the substrate defining the passages are coated with a conductive metal. This provides a conti...
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WO/1995/005416A2 |
Water-soluble pressure-sensitive adhesives include a water-soluble polymer that is made tacky at room temperature by addition of a water-soluble plasticizer that is miscible with the polymer. Suitable polymers are solid at room temperatu...
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WO/1995/004786A2 |
Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
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WO/1994/029397A1 |
An anisotropically conductive adhesive composition provides electrical conductivity between facing electrodes but maintains electric insulation laterally between adjacent electrodes and comprises (a) a cationically polymerizable monomer,...
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WO/1994/024218A1 |
An antistatic adhesive article which comprises an adhesive layer and utilizes vanadium oxide to impart antistatic properties to the article. The article is preferably an adhesive tape or sheet. The adhesive may be pressure sensitive or n...
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WO/1994/022972A1 |
The present invention provides a reworkable, semi-crystalline thermoplastic adhesive composition, suitable for bonding electronic components. The adhesive composition, preferably provided as an adhesive film, includes one or more poly(et...
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WO/1994/014273A1 |
An information delivery system comprises equipment located at a first or storage location (10) and additional equipment located at a second or utilization location (11). The locations are interconnected for transmission of information th...
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WO/1993/009197A1 |
This invention relates to a self-fading color adhesive. Upon application, the adhesive exhibits coloring which enables confirmation of coating area and weight of the adhesive. Upon drying, the adhesive fades to clear. The self-fading col...
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WO/1993/003109A2 |
Described is a dimensionally stable adhesive stick, sufficiently soft for the adhesive to be rubbed off, consisting of an aqueous preparation of starch derivatives and a soap gel as the body substance which gives the stick its shape plus...
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WO/1993/001421A1 |
An adhesive composition for being applied to at least one of thread contact faces of screw members so as to stick said thread contact faces to each other in engaging the screw members with each other for the purpose of locking and sealin...
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WO/1993/001248A1 |
A composition for forming an anisotropic conductive film having a rapid curing speed, high heat resistance, high humidity resistance, long shelf life and excellent repairability comprising an adhesive composition containing about 100 par...
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WO/1993/001247A1 |
An adhesive article for use in a microwave oven is provided having a hot-melt or heat-curable adhesive substrate, and a susceptor layer of electrically conductive or semi-conductive microwave absorbing material that is disposed on at lea...
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WO/1992/013901A1 |
Adhesive compositions are provided which are tacky within a predetermined temperature range and will strongly bond an article to a substrate within a given temperature range, but which are substantially nontacky at temperatures outside e...
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WO/1992/003516A1 |
The present invention provides an adhesive composition that is useful as an energy-curable, one-part adhesive, suitable for bonding electronic components. The adhesive composition, preferably provided as an adhesive film, comprises the r...
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WO/1991/018957A1 |
Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing.
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WO/1991/013445A1 |
A copper alloy composition comprising 100 parts by weight of a powdery copper alloy of the general formula AgxCuy (wherein 0.001 x 0.999, 0.001 y 0.999 and x + y = 1), 5 to 200 parts by weight of an organic binder, and 0.01 to 100 parts ...
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WO/1991/011493A2 |
An electrically conductive pressure sensitive adhesive is provided which is prepared by incorporating a conductive black filler into a pressure sensitive adhesive in such a manner as to impart electrical conductivity at a carbon concentr...
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WO/1991/006424A1 |
A positionable-repositionable pressure-sensitive adhesive may be repeatedly applied to a surface and removed during an initial installation time period. A laminate (10) is shown comprising a substrate or carrier layer (12) secured to a p...
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WO/1991/006961A1 |
A polymer composition comprises a solid fusible particulate polymer material and a quantity of metal particles that have been blended with the particles of polymer material to render the composition electrically conductive. The compositi...
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WO/1990/013420A1 |
Temperature-activated adhesive compositions formulated with crystallizable polymers are provided. The compositions, which display a rapid transition from the tacky to the nontacky state, and/or from the nontacky to the tacky state, are u...
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WO/1990/009413A1 |
A two phase adhesive matrix for use in an electrically powered iontophoretic delivery device is provided. The adhesive matrix comprises an adhesive hydrophobic polymer phase and about 15 to 60 wt% on a dry weight basis of a hydrophilic p...
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WO/1990/001525A1 |
An adhesive composition comprising a polymer, a tackifier, and a plasticizing amount of 1,4-cyclohexane dimethanol dibenzoate.
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WO/1989/001225A1 |
The invention is a die attach adhesive composition comprising a homogeneous blend of an organopolysiloxane-bridged bisbenzocyclobutene monomer, an organosilane adhesion aid, and a finely divided electrically conductive metal. The composi...
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JP2024078385A |
The present invention provides a conductive polymer solution in which the conductive polymer has high dispersibility in an adhesive and the conductive polymer is less likely to aggregate. [Solution] A conductive polymer solution is used,...
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JP7496949B1 |
The present invention provides a conductive adhesive layer that can exhibit sufficient adhesive strength to various adherends even under low-temperature, short-time compression processing conditions. [Solution] The conductive adhesive la...
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JP7494411B1 |
Provided is a conductive adhesive layer that can exhibit sufficient adhesive strength to various adherends even under low-temperature, short-time pressure bonding conditions. The conductive adhesive layer (1) contains a binder component ...
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JP7491463B2 |
This electrically conductive resin composition contains (A) silver-containing particles, (B) a (meth)acrylic compound, and (C) at least one polyfunctional epoxy compound selected from compounds represented by general formula (1).
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JP2024070257A |
An object of the present invention is to provide a thermally conductive material for automobiles having a composition that does not contain any organic substance having a melting point of less than 55°C. The composition of the thermally...
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JP2024069357A |
A low-temperature thermosetting resin composition, an anisotropic conductive film, and a connection structure are provided. [Solution] The thermosetting resin composition contains an alicyclic epoxy resin in a content of 0.05% to 5.0% by...
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JP2024068578A |
The present invention provides a resin composition in which the tensile strength of the cured product is maintained even when the cured product is stored for a long period of time at high temperature and high humidity. A resin compositio...
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JP7485279B2 |
To provide a conductive surface treatment powder filler capable of imparting selectivity of excellent conductivity and color tone such as whiteness or transparency, against a rubber or a resin composition, and its manufacturing method, a...
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JP7484196B2 |
An addition-curing silicone pressure-sensitive adhesive composition which contains no noncrosslinking organopolysiloxane resin and comprises100 parts by mass of (A) an organopolysiloxane having, in the molecule, at least two alkenyl grou...
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JP7484131B2 |
To provide a compound that is fluidized by light irradiation and is un-fluidized reversibly, and shows no excessive coloration.The present invention relates to a compound that is fluidized by light irradiation and is un-fluidized reversi...
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JP2024065119A |
The present invention provides a piezoelectric vibrator and a method for manufacturing the piezoelectric vibrator that can both reduce the elastic modulus and improve the conductivity of a conductive holding member. A piezoelectric vibra...
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JP2024063368A |
The present invention provides a connection material, a connection structure, and a method for manufacturing a connection structure that can provide excellent connection reliability and repairability. [Solution] The connecting material c...
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JP7473763B2 |
To provide a conductive hot-melt adhesive composition which can strongly bond adherends in a state of exhibiting high conductivity.A conductive hot-melt adhesive composition contains a thermoplastic resin and a conductive filler, and has...
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JP2024056396A |
An object of the present invention is to provide a hemming part structure for an automobile body that can suppress corrosion of an outer panel and an inner panel, regardless of whether the adhesive used for the hemming part is conductive...
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JP7471773B2 |
A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form...
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JP7470179B2 |
The present invention provides an electroconductive adhesive which is capable of achieving sufficient connection stability even if used in a harsh environment. An electroconductive adhesive according to the present invention is character...
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JP7468507B2 |
One aspect of the present invention is an adhesive film for circuit connection, provided with: a first adhesive layer containing conductive particles and a second adhesive layer disposed on the first adhesive layer, wherein the shortest ...
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