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JP7309522B2 |
Provided is a polarization film laminate, etc., with which it is possible to comprehensively solve the problems of polyenization, decoloration, and heating reddening. A polarization film laminate comprising a polarization film that inc...
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JP7308028B2 |
To provide means for balancing connectibility and insulation quality with high level, in an anisotropic conductive film.In an anisotropic conductive film, an intermediate layer, i.e., a hardening layer of an uncured intermediate layer, h...
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JP7306594B1 |
Kind Code: A1 A conductive film, a wound body, a connection structure, and a method for manufacturing a connection structure are provided, in which an adhesive film can be attached to adhesive surfaces of various shapes and the adhesive ...
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JP7305957B2 |
A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release f...
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JP2023094423A |
To provide an adhesive composition usable also for connection that requires higher adhesion strength due to substrate difference such as FOG or COG mounting, and excellent in dispersibility of conductive particles and connection reliabil...
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JP2023092814A |
To provide an adhesive composition capable of having excellent sticking property to a circuit member even after preserving an adhesive composition, having ease of peeling to a peeling layer, and securing connection reliability between el...
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JP7302724B2 |
To provide an adhesive composition that has high storage stability and can be cured at relatively low temperature and in a short time.An adhesive composition comprises an onium salt represented by a general formula (1), a cationic polyme...
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JP2023093425A |
To provide a conductive paste which is sufficiently bonded to an electronic component in a manufacturing process, and a method for manufacturing an electronic device using the same.A method for manufacturing an electronic device includes...
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JP2023090996A |
To provide an adhesive film having excellent antistatic properties without impairing adhesive performance and excellent reworkability.There is provided an adhesive film in which an adhesive layer obtained by crosslinking an adhesive comp...
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JP2023086476A |
To provide an adhesive film for circuit connection which improves a conductive particle capturing rate between opposite electrodes of a circuit connection structure, and can reduce connection resistance of the circuit connection structur...
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JP7294145B2 |
One embodiment of the present invention provides an adhesive composition which contains conductive particles and a compound having a nitrogen-containing aromatic heterocycle.
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JP7290118B2 |
This thermally conductive silicone adhesive composition comprises: (A) an organopolysiloxane which has an alkenyl group and does not have an organoxysilyl group; (B) an organopolysiloxane blocked with trialkoxysilyl groups at both termin...
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JP7289993B2 |
An object of the present disclosure is to provide a conductive adhesive layer in which the connection stability between objects that are conductive members is excellent, and the connection stability is maintained even when the conductive...
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JP7287275B2 |
An aspect of the present invention relates to an adhesive composition which comprises an adhesive component and electroconductive particles, wherein the electroconductive particles each comprise a plastic particle and a metal layer cover...
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JP2023076211A |
To provide a conductive adhesive that is suitably usable for a jet dispenser and has low viscosity, and can maintain a fixed discharge shape and discharge amount, prevents clogging of a nozzle and can be continuously discharged, provides...
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JP7283654B2 |
To provide an adhesive sheet, the sheet increasing manufacturing efficiency of products including an adhesive agent layer, while using the adhesive agent layer to which an electro-conductive organic polymer compound is added. An adhesive...
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JP2023522427A |
The present invention relates to a thermally detachable two-layer adhesive system, an adhesive detachment method using the adhesive system, and a thermally detachable bonded composite. In particular, the invention relates to a thermally ...
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JP7283395B2 |
One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a fir...
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JP7282034B2 |
Thermally-conductive gap fillers are described. The gap fillers comprise an aziridino-functional polyether polymer and thermally conductive particles. Initiators suitable for such systems ae also described. Such gap fillers may be used i...
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JP7281179B2 |
To provide: a conductive adhesive including micro phase separation, where conductive particles tend to be unevenly distributed more in a base resin than in a region formed by in-situ polymerization; and a method for using a conductive ad...
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JP2023072774A |
To provide an anisotropic conductive film which facilitates production, enables long-term storage, does not have an adverse impact on the peripheral environment, and can efficiently connect a terminal of an electronic component in a shor...
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JP7278288B2 |
The present invention relates to a thermally conductive adhesive composition having excellent mechanical properties and a method of manufacturing the same. Further, the present invention relates to method of manufacturing an article comp...
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JP7278023B2 |
To provide a conductive paste sufficiently adhering to an electronic component during a manufacturing process, and a method of manufacturing an electronic device using the same.A method of manufacturing an electronic device includes the ...
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JP2023068799A |
To provide a conductive adhesive or the like that can prevent the viscosity of a conductive adhesive composition from increasing with time.A conductive adhesive according to the present invention comprises an elastomer and metal particle...
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JP7274810B2 |
An anisotropic conductive film capable of accommodating bumps with a narrow pitch and reducing the number density of conductive particles in comparison to known anisotropic conductive films. In an anisotropic conductive film, conductive ...
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JP2023520092A |
An improved elastic seam tape with a conductor and a method of making the elastic seam tape are provided. A long seam tape comprises a long elastic first layer (1) and a long elastic second layer (2) partially joined to the first layer (...
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JP7273283B2 |
The adhesive composition according to the present invention, which is capable of realizing low-temperature quick-curing properties, conductive properties, shelf life properties, and adhesive strength that are practical not only for COG m...
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JP2023064469A |
To provide a conductive resin composition which is useful as a conductive material for a flexible hybrid electronics field, especially, a conductive connection material for a wearable application and an electronic shelf label, is a low t...
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JP2023064722A |
To provide a conductive resin composition which exhibits good conductivity, is excellent in adhesion (bond strength) to various substrates, and is useful as conductive ink, a conductive adhesive and a circuit connection material; a condu...
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JP2023064723A |
To provide a conductive resin composition which exhibits good conductivity, is excellent in adhesion (bond strength) to various substrates, and is useful as conductive ink, a conductive adhesive and a circuit connection material; a condu...
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JP2023064724A |
To provide a conductive resin composition which exhibits good conductivity, is excellent in adhesion (bond strength) to various substrates, and is useful as conductive ink, a conductive adhesive and a circuit connection material; a condu...
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JP2023064721A |
To provide a conductive resin composition which exhibits good conductivity, is excellent in adhesion (bond strength) to various substrates, and is useful as conductive ink, a conductive adhesive and a circuit connection material; a condu...
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JP2023063770A |
To provide an adhesive film for circuit connection that makes it possible to make a circuit connection structure having excellent adhesion to a plastic substrate without providing a tackifier layer, and also having excellent connection r...
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JP2023061166A |
To provide an adhesive tape for circuit connection that is less likely to cause peeling of an adhesive film from a substrate when the adhesive tape is processed, the adhesive tape exhibiting excellent processability.An adhesive tape for ...
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JP7266114B2 |
A method for the cold retreading of a tire comprising the following steps: a removal step, wherein the tread is removed from the tire, exposing an equatorial surface of a casing of the tire; a deposition step, during which a cushion and ...
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JP7265597B2 |
Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to ...
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JP7265599B2 |
Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to ...
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JP7265598B2 |
A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the ...
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JP7264054B2 |
This adhesive film 1 for circuit connections is provided with a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on said first adhesive layer 2, wherein the ratio of the melt viscosity of ...
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JP7264598B2 |
[Problem] To provide an adhesive composition with high adhesion reliability, a connection structure, and a manufacturing method of the connection structure. [Solution] This adhesive composition contains a film forming resin, an acrylate-...
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JP7264645B2 |
To provide a double-sided adhesive sheet which repeats sticking of a workpiece such as a film-like base material and a semiconductor member to a transporting jig, and processing and peeling thereof many times and can be used, and can pre...
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JP7264761B2 |
To provide an insulating tackifier/adhesive composition and an insulating tackifier/adhesive sheet excellent in tackiness at room temperature (25°C) while excellent in adhesiveness and further excellent in dielectric breakdown resistanc...
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JP7258733B6 |
To provide an antistatic adhesive tape having excellent conductivity, heat resistance, solvent resistance and chemical resistance.An antistatic adhesive tape 10 for semiconductor production equipment includes a resin layer 11 containing ...
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JP2023057839A |
To provide means that does not substantially cause a deterioration of performance in an electric device even under non-high-temperature conditions, such as at the room temperature, and can electrically bond the electric device with high ...
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JP2023055754A |
To provide a curing agent that allows an adhesive composition to be cured at lower temperatures (for example, 120°C), an adhesive composition comprising the curing agent, an adhesive film for circuit connection, a connection structure a...
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JP2023051946A |
To provide a method for manufacturing a semiconductor device which easily separates a temporarily fixed semiconductor member from a support member.A method for manufacturing a semiconductor device includes the steps of: preparing a lamin...
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JP2023050157A |
To make it possible to realize excellent filler retention and excellent temporary adhesion, without using a throughhole as a site for placing a filler in a filler-containing film such as an anisotropic conductive film, and also to realiz...
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JP2023050162A |
To provide a method of producing a connecting film with high productivity.An adhesive is printed in a predetermined shape on a release-processed film to form a connecting film of a predetermined shape on the release-processed film. A plu...
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JP2023048546A |
To provide a thermally conductive adhesive sheet which can form a cured sheet having excellent adhesiveness to an adherend when pressure bonded at low pressure and has excellent thermal conductivity of the cured sheet formed.There is pro...
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JP7249473B1 |
Provided is a conductive resin composition which can be cured at a temperature of 150° C. or less and has excellent conductivity, adhesive strength and solvent resistance after curing. 0.3 to 5 parts by mass of (B) a cationic initiator ...
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