Title:
接着剤組成物、接続構造体及びその製造方法
Document Type and Number:
Japanese Patent JP7294145
Kind Code:
B2
Abstract:
One embodiment of the present invention provides an adhesive composition which contains conductive particles and a compound having a nitrogen-containing aromatic heterocycle.
Inventors:
Kengo Shinohara
Yasunori Kawabata
Takashi Tachizawa
Kazue Sakano
Yasunori Kawabata
Takashi Tachizawa
Kazue Sakano
Application Number:
JP2019566472A
Publication Date:
June 20, 2023
Filing Date:
January 15, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C09J201/00; C09J9/02; C09J11/06; C09J11/08; H01B1/20
Domestic Patent References:
| JP2002167569A | ||||
| JP2008069237A | ||||
| JP63293179A |
Foreign References:
| US20060081819 | ||||
| WO2016203510A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Sayako Mizuki
Yoshinori Shimizu
Hiroyuki Hirano
Sayako Mizuki
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