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WO/2008/047600A1 |
Disclosed is a coated particle (10) which is obtained by coating at least a part of the surface of a functional group-containing conductive particle (8), which has a conductive metal surface at least a part of which is provided with a fu...
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WO/2008/048207A2 |
The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides ...
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WO/2008/038565A1 |
An anisotropic conductive adhesive composition is provided for connecting a first circuit member, which has a first circuit electrode on the main surface of a first substrate, and a second circuit member, which has a second circuit elect...
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WO/2008/034487A1 |
The invention relates to a method of producing a membrane, in particular a polymer membrane, preferably an ultrafiltration membrane or nanofiltration membrane, and also to a membrane produced by this method and to the use of such a membr...
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WO/2008/029580A1 |
An anisotropic conductive tape (1) for electrically connecting opposed circuit electrodes to each other comprises a tape-like base (20) and adhesive agent layers (11b, 12b) arranged parallel with each other on the major surface of the ba...
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WO/2008/026517A1 |
A conductive bonding material which comprises: a thermosetting resin (7); low-melting metal particles (8) which melt at a temperature not higher than the thermosetting temperature of the thermosetting resin (7); high-melting metal partic...
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WO/2008/025966A1 |
The present invention provides compositions ("Optical Nanomaterial Compositions") comprising one or more nanomaterials and an optical coupling gel or an optical adhesive. The invention also provides methods for using the Optical Nanomate...
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WO/2008/023565A1 |
Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of s...
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WO/2008/023670A1 |
Disclosed is a circuit connecting material for electrically connecting a first circuit member, wherein a first circuit electrode is formed on a major surface of a first circuit board, with a second circuit member, wherein a second circui...
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WO/2008/023452A1 |
Disclosed is an adhesive tape (101) for electrically connecting conductive members to each other. The adhesive tape (101) comprises a resin layer (132) containing a thermocurable resin, a solder powder (103), and a curing agent. The sold...
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WO/2008/013252A1 |
Provided is a heat conductive adhesive having a high heat dissipating characteristic and excellent handleability. The heat conductive adhesive which has excellent handleability and conducts heat is manufactured by compounding a pitch bas...
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WO/2008/004287A1 |
It is intended to provide a conductive adhesive which does not have a problem of migration of a conductive metal upon applying voltage and exhibits a low resistance value. One embodiment of the invention relates to a conductive adhesive ...
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WO/2008/004367A1 |
A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has ...
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WO/2007/149613A1 |
A flame retardant adhesive pressure sensitive adhesive containing a blend of flame retardants is provided. The flame retardant blend comprises (a) at least one metal oxide; (b) at least one metal hydrate; (c) at least one halogenated mat...
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WO/2007/142600A1 |
The present invention relates to an electrochemically weakable adhesive composition, possessing adhesive properties to provide an adhesive bond to an electrically conducting surface and sufficient ion conductive properties to enable a we...
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WO/2007/125650A1 |
Disclosed is an adhesive tape for electrically connecting conductive members to each other. The adhesive tape comprises a resin, a solder powder and a curing agent having a flux activity, wherein the solder powder and the curing agent ar...
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WO/2007/118529A1 |
Hot-hardening, reactive compositions based on natural and/or synthetic olefinic, double-bonded elastomers and vulcanizing agents are described that contain at least one fluid polyene with a molecular weight between 400 and 80,000 as well...
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WO/2007/120078A2 |
The invention relates to semiconductor engineering, in particular to methods and compositions for producing semiconductor devices and microelectronic integrated circuits, in particular to processes for obtaining gluing electroconductive ...
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WO/2007/107591A1 |
The invention relates to adhesive masses containing at least one electroluminescent additive, single and double-sided adhesive strips which are provided with adhesive masses of said type, and to the use of said adhesive masses for sticki...
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WO/2007/091937A1 |
The invention relates to a laminate structure comprising a first carrier layer with a surface, a first active surface being electrically conducting and being supported by the first carrier layer, a second active surface being electricall...
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WO/2007/088666A1 |
This invention provides a heat curable adhesive that, when an electronic component is pressure bonded onto a substrate with the aid of a heat curable adhesive such as an anisotropic electroconductive adhesive, can facilitate repair. The ...
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WO/2007/083823A1 |
Disclosed is an androgen receptor-binding substance comprising an extract from a Ganoderma mushroom (Ganoderma lucidum) as an active ingredient. The androgen receptor-binding substance is useful as a reagent for use in the study on signa...
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WO/2007/080842A1 |
An isotropically conductive adhesive sheet that realizes simplification of the step of bonding a metallic reinforcing plate to a main body of circuit board and imparting of conduction reliability and electromagnetic shielding effect to t...
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WO/2007/071246A1 |
The invention relates to a method for assembling an adhesive device comprising a first matrix-forming material with holes and a second material, the method comprising: (a) compose the first matrix-forming material with holes; (b) compose...
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WO/2007/061613A1 |
The invention provides anisotropically conductive adhesive compositions, which comprise a mixture of a multifunctional glycidyl ether epoxy resin, a phenoxy resin, a core-shell polymer, optionally a thermoplastic resin, a thermally activ...
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WO/2007/058159A1 |
An adhesive composition is provided with an adhesive component and conductive particles (10) dispersed in the adhesive component. The conductive particle (10) is provided with a base material particle (1) constituting the center portion,...
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WO/2007/058108A1 |
Anisotropic conductive adhesive (10) comprising base film (12) and, superimposed thereon, anisotropic conductive film (14) having conductive particles dispersed in an insulating adhesive, wherein the anisotropic conductive film (14) has ...
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WO/2007/054241A1 |
The invention relates to a nanoparticulate preparation which comprises a coherent phase and, disperse therein, at least one particulate phase of superparamagnetic, nanoscale particles having a volume-averaged diameter in the range from 2...
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WO/2007/054455A1 |
The invention relates to a method for producing pressure-sensitive adhesives that have low or no anisotropy, the process elements including an adhesive supply system, an application unit and a placement element. A melt strip of the press...
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WO/2007/052661A1 |
Disclosed is a conductive adhesive which prevents migration and sulfuration of a metal component during mounting of electronic components. Such a conductive adhesive is obtained by dispersing metal filler particles in a thermosetting res...
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WO/2007/046190A1 |
An adhesive composition which contains an adhesive component comprising a thermoplastic resin, a radical-polymerizable compound, and a radical polymerization initiator, wherein the adhesive component exhibits a signal in the ESR measurem...
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WO/2007/046189A1 |
An adhesive composition comprising a thermoplastic resin, a radical-polymerizable compound, a radical polymerization initiator, a nitroxide, and a basic compound.
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WO/2007/044349A1 |
An adhesive tape with an antistatic release coating is provided. The release includes an antistatic additive made from a reaction product of from about 1 to 30 parts hydrophilic monomer, from about 5 to 40 parts ionic monomer, and from a...
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WO/2007/034925A1 |
A particle classification apparatus capable of precision classification of particles with uniform length; and an adhesive containing particles classified by the apparatus that is capable of inter-electrode connection under low pressure a...
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WO/2007/029534A1 |
Disclosed is a method for producing a polyamide acid containing ultrafine metal particles, which is characterized in that metal ions are adsorbed onto polyamide acid fine particles by bringing an aqueous solution containing a water-solub...
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WO/2007/021977A1 |
A surface cover having a polarized adhesive material bonded or operably connected to at least a portion of a substrate. The polarized adhesive material may be hot melt adhesive material. The substrate may have little or no electret capab...
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WO/2007/019115A1 |
A conductive adhesive composition is provided and articles that include the adhesive composition as a component thereof. The conductive adhesive composition comprises: (a) pressure sensitive adhesive; (b) electrolyte comprising water sol...
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WO/2007/015675A1 |
The invention relates to a laminate structure comprising a first active layer having a first electrode potential, a second active layer having a second electrode potential, wherein the second electrode potential being different from the ...
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WO/2007/015672A1 |
The disclosure relates to a package comprising a first portion and a second portion (or a first package member and a second package member) adapted to be connected to each other and thereby keep the package closed, wherein the first and ...
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WO/2007/015674A1 |
The invention relates to a package, e.g. a blister package, comprising two spaced apart first and second walls formed and joined to each other to define a cavity between them, said walls having peripheral edges and being sealed together ...
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WO/2007/015673A1 |
The disclosure relates to a connecting element adapted to temporarily holding together a plurality of articles, the connecting element comprising a base member provided with a first adhesion area adapted to hold a first secondary article...
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WO/2007/006633A1 |
The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive ...
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WO/2007/007135A2 |
A paste or adhesive used to attach wallpaper or other material to a substrate is provided with at least one colouring agent to make the paste or adhesive visible against the colour of the wallpaper or other material. For example, the col...
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WO/2006/132500A1 |
The present invention relates to an acrylic pressure sensitive adhesive composition, specifically, an acrylic pressure sensitive adhesive composition having improved anti-static properties, comprising 100 part by weight of acrylic copoly...
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WO/2006/126305A1 |
A modified polyurethane resin comprising a molecular chain represented by the following general formula (I) and an adhesive composition comprising the same. [Chemical Formula 1] (I) (In the formula, X represents a divalent organic group ...
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WO/2006/121174A1 |
The present invention provides a pressure-sensitive adhesive composition comprising a near infrared ray absorption agent excellent in heat resistance and hygrothermal resistance while maintaining sufficient NIR shield characteristics and...
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WO/2006/101127A1 |
To provide is an electroconductive joining material which exhibits high storage stability and, when desired, can be cured, preferably rapidly at a low temperature. In one invention, an electroconductive joining material contains an elect...
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WO/2006/098352A1 |
Disclosed is an adhesive composition containing a radical generator, a thermoplastic resin, and a urethane (meth)acrylate having two or more radically polymerizable groups in a molecule whose weight average molecular weight is 3,000-30,000.
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WO/2006/094977A2 |
The invention relates to superabsorbing foam which contains 0.01 wt. % - 10 wt. % of fibres which are made of wood pulp or waste paper, in relation to the dry weight of the foam.
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WO/2006/093315A1 |
An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insula...
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