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Title:
絶縁パッドコンディショナおよびその使用方法
Document Type and Number:
Japanese Patent JP2007528299
Kind Code:
A
Abstract:
A wafer planarization process with a conditioning tool having an electrical insulator that electrically insulates the abrasive surface of the conditioning tool. The electrical insulator extends the useful life of the abrasive surface of the conditioning tool by reducing the level of electrochemically driven corrosion.

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Inventors:
Palm Glen, Gary M.
Goars, Brian Dee.
Fischer, Douglas Jay.
Application Number:
JP2007502803A
Publication Date:
October 11, 2007
Filing Date:
January 25, 2005
Export Citation:
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Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
B24B53/12; B24B37/04; B24B53/007; B24D3/00; B24D3/06; H01L21/306
Foreign References:
WO2003072672A12003-09-04
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu



 
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