Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2709484
Kind Code:
B2
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Inventors:
Minoru Hirai
Application Number:
JP23331688A
Publication Date:
February 04, 1998
Filing Date:
September 17, 1988
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/60; H01L23/50; (IPC1-7): H01L21/60; H01L21/60; H01L23/50
Domestic Patent References:
| JP5832441A | ||||
| JP6334935A | ||||
| JP5755953U |
Attorney, Agent or Firm:
Koji Onishi