Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3989869
Kind Code:
B2
Abstract:
A semiconductor device which is manufactured through a process of forming a second structure on a first structure, by using a photolithography technique, the semiconductor device includes a mark which is provided at a part of the first structure to be covered by the second structure and which is necessary for forming the second structure.
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Inventors:
Takushi Ohsumi
Application Number:
JP2003109378A
Publication Date:
October 10, 2007
Filing Date:
April 14, 2003
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L21/027; G03F1/42; G03F9/00; H01L21/3205; H01L21/60; H01L21/768; H01L23/12; H01L23/31; H01L23/485; H01L23/52; H01L23/522; H01L23/544
Domestic Patent References:
| JP60014438A | ||||
| JP11067620A | ||||
| JP6077471A | ||||
| JP2003023124A | ||||
| JP2002299358A | ||||
| JP2002057291A |
Attorney, Agent or Firm:
Koichi Suzuki