Title:
チップ型電子部品
Document Type and Number:
Japanese Patent JP4111340
Kind Code:
B2
Abstract:
To provide the chip-type electronic component of the structure that extending of plating in the electroplating of terminal electrode can be prevented, without forming an insulator layer on the surface of a single material formed of a ceramics semiconductor.
The surface roughness Ra of the single material 1 and the radius R of an inscribed circle of the angled portion 6, between the side surface of the single material and upper and lower surfaces satisfy the relations 0.1 μm ≤Ra≤0.5 μm and R≥0.03×W (where W is the width of single material 1) or of 0.1 μm ≤Ra≤0.6 μm and R≥0.05×W or 0.1 μm ≤Ra≤2.0 μm and R ≥ 0.10×W.
COPYRIGHT: (C)2005,JPO&NCIPI
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Inventors:
Goro Takeuchi
Hiroyuki Sato
Keisuke Akagi
Hiroyuki Sato
Keisuke Akagi
Application Number:
JP2004060602A
Publication Date:
July 02, 2008
Filing Date:
March 04, 2004
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01C7/04; H01C7/02; H01C7/10
Domestic Patent References:
| JP10223409A | ||||
| JP2000003805A | ||||
| JP2001006964A | ||||
| JP9232106A |
Attorney, Agent or Firm:
Katsuichi Wakata
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