Title:
膜厚測定装置および膜厚測定方法
Document Type and Number:
Japanese Patent JP5309359
Kind Code:
B2
Abstract:
The present invention relates to a film thickness measuring device and a film thickness measurement method. A model part (721A) based on parameter update instructions of the fitting part (722) is used to sequentially update the first one layer film thickness d1, and then based on the updated first layer film thickness d1, function of illustrating theoretical reflectivity is updated. Further, according to the updated function the model part (721A) calculates the theoretical reflectivity of various wavelengths (spectrum). According to this method, the first layer film thickness d1 is determined by using a fitting method. When the fitting method can not converge in a preset number of iteration, then Fourier transform is used to determine the first layer film thickness d1.
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Inventors:
Fujimori Tadashi
Sawamura Yoshimi
Sawamura Yoshimi
Application Number:
JP2008162046A
Publication Date:
October 09, 2013
Filing Date:
June 20, 2008
Export Citation:
Assignee:
Otsuka Electronics Co., Ltd.
International Classes:
G01B11/06; H01L21/66
Domestic Patent References:
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| JP2003240515A | ||||
| JP2000310512A | ||||
| JP2005201634A | ||||
| JP2004119452A | ||||
| JP2004205242A | ||||
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| JP10125634A | ||||
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Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa