Title:
パッケージの製造方法及びパッケージ
Document Type and Number:
Japanese Patent JP5479874
Kind Code:
B2
Abstract:
There is provided a package manufacturing method capable of manufacturing high-quality and high-accuracy products without requiring complicated processes. A method for manufacturing a package including a base board and a lid board bonded to each other so as to form a cavity at an inner side and penetration electrodes that electrically connect the inside of the cavity to the outside of a base board made of a glass material includes a penetration hole forming step of forming penetration holes in a base board wafer; a rivet member insertion step of inserting conductive rivet members made of a metal material into the penetration holes; a welding step of heating the base board wafer to a temperature higher than the softening point of the glass material so as to weld the base board wafer to the rivet members; and a cooling step of cooling the base board wafer. Each of the rivet members has one end of which the sectional area is larger than the other portion, and the one end is positioned in the outside of the base board.
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Inventors:
Yoshihisa Taya
Yoshida Yoshifumi
Yoshida Yoshifumi
Application Number:
JP2009280898A
Publication Date:
April 23, 2014
Filing Date:
December 10, 2009
Export Citation:
Assignee:
Seiko Instruments Inc.
International Classes:
H03H3/02; H01L23/08; H01L23/12; H03H9/02; H03H9/10
Domestic Patent References:
| JP6045022A | ||||
| JP5167244A | ||||
| JP2003209198A | ||||
| JP2004007236A | ||||
| JP2004096721A | ||||
| JP2007228443A |
Foreign References:
| WO2009104308A1 | ||||
| WO2009104293A1 |
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura
Noriaki Uchino
Nobuyuki Kimura