Title:
PIEZOELECTRIC DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3924810
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent problems such as peeling of a composite substrate and make the manufacturing of a piezoelectric device easy and achieve a high yield and reliability by forming grooves in at least one of two substrates to be directly joined together.
SOLUTION: The surfaces of an AT-cut quartz substrate 1 and a silicon substrate 2 are mirror-polished and washed and then surface layers of these substrates are removed with etchant. Then, grooves 3 are formed in the mirror- polished surface of the silicon substrate 2 by etching. After that, the mirror- polished surfaces of the quartz substrate 1 and the silicon substrate 2 are put together. Then, heat treatment is conducted to adhere and join these substrates. The silicon substrate 2 is etched to the quartz substrate 1 to form an opening. Then, an electrode 4 is formed on the quartz substrate 1. Thus manufactured composite substrate is diced along the grooves into a plurality of piezoelectric devices. A plurality of the grooves 3 formed in the silicon substrate 2 lessen thermal stress in a junction face between the two substrates. And, the manufacturing with a good mass-productivity can also be achieved.
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Inventors:
Akihiko Nanba
Tetsuyoshi Obori
Yoshihiro Tomita
Kazuo Eda
Tetsuyoshi Obori
Yoshihiro Tomita
Kazuo Eda
Application Number:
JP18455796A
Publication Date:
June 06, 2007
Filing Date:
July 15, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L41/08; H01L21/02; H01L27/00; H01L27/12; H01L41/22; H03H3/02; H03H3/08; H03H9/19; H03H9/25; (IPC1-7): H01L41/08; H01L21/02; H01L27/12; H01L41/22; H03H3/02; H03H3/08; H03H9/19; H03H9/25; //H01L27/00
Domestic Patent References:
| JP4283957A | ||||
| JP7038361A | ||||
| JP7169924A | ||||
| JP6120581A | ||||
| JP5286131A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano