Title:
PRODUCTION OF THIN FILM MULTILAYER BOARD AND PATTERN INSPECTION SYSTEM
Document Type and Number:
Japanese Patent JP3924809
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To produce a thin film multilayer wiring board having a large area at high yield.
SOLUTION: A new layer, including an insulation layer 102a and a wiring later 104a, is inspected every time when it is formed and defects are corrected. A next layer is then formed under a defect-free state thus increasing the production yield. The ratio of the quantity of light between the illumination angles is optimized for each inspection process and then the pattern is detected thus inspecting the entire process.
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Inventors:
Hiroya Koshishiba
Chie Shishido
Hiroto Okuda
Takanori Ninomiya
Chie Shishido
Hiroto Okuda
Takanori Ninomiya
Application Number:
JP18440396A
Publication Date:
June 06, 2007
Filing Date:
July 15, 1996
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G01N21/88; H05K3/46; G01N21/956; (IPC1-7): H05K3/46; G01N21/88
Domestic Patent References:
| JP4102395A | ||||
| JP3263896A | ||||
| JP7336024A | ||||
| JP6027034A | ||||
| JP7202430A | ||||
| JP2254792A | ||||
| JP7086722A | ||||
| JP1263540A | ||||
| JP6300702A | ||||
| JP7159335A |
Attorney, Agent or Firm:
Manabu Inoue
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