Title:
フィルム状接着剤及びこれを用いた半導体装置
Document Type and Number:
Japanese Patent JP5626179
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a film adhesive that can be excluded sufficiently from contact surface in electrical connection of a semiconductor chip with a circuit board using an adhesive, and can prevent the chip from crack because a load required for sufficient electric connection is low, hence can ensure excellent connection reliability, and to provide a semiconductor device using the same.SOLUTION: The film adhesive has a viscosity that amount to not more than 200 Pa s at any temperature of 50-250°C, and a cured product thereof has an average linear expansion coefficient of not more than 200 ppm/°C in the temperature range of 25-260°C.
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Inventors:
本村 耕治
竹村 賢三
永井 朗
愛知 且英
榎本 哲也
竹村 賢三
永井 朗
愛知 且英
榎本 哲也
Application Number:
JP2011233035A
Publication Date:
November 19, 2014
Filing Date:
October 24, 2011
Export Citation:
Assignee:
日立化成株式会社
International Classes:
C09J7/00; C09J11/04; C09J133/00; C09J163/00; H01L21/52; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
古下 Tomoya
Toshiaki Sakanishi
Kido 博兒
Ikeda Masato
Yoshinori Shimizu
古下 Tomoya
Toshiaki Sakanishi
Kido 博兒
Ikeda Masato