Title:
切削加工用粘着テープ
Document Type and Number:
Japanese Patent JP5717420
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive tape for cutting processing that is available for both processes of a wafer or glass dicing step and a package dicing step, is suitable for dicing using a laser beam, and has a strong adhesive force.SOLUTION: An adhesive tape for cutting processing that is used for manufacturing a semiconductor chip, a MEMS (Micro Electro Mechanical Systems) device, a functional glass substrate, and a semiconductor package and the like from a plate-like to-be-cut object, has a base material 1 and an adhesive layer 2 arranged on the base material 1. The adhesive layer 2 is constituted by a photocuring type rubber system adhesive agent whose main component is an admixture obtained by blending, in a predetermined ratio, an elastomer (A) and a conjugated diene system polymer (B) containing an average of two or more (meta) acryloyl groups per one molecule.
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Inventors:
Hirokazu Sato
Rie Osuka
Takahiro Sakai
Rie Osuka
Takahiro Sakai
Application Number:
JP2010267402A
Publication Date:
May 13, 2015
Filing Date:
November 30, 2010
Export Citation:
Assignee:
Hitachi Maxell Co., Ltd.
International Classes:
H01L21/301; C09J7/02
Domestic Patent References:
| JP2003238936A | ||||
| JP2008163276A | ||||
| JP2010073897A | ||||
| JP5175332A | ||||
| JP2008166651A |
Foreign References:
| US20070241436 |
Attorney, Agent or Firm:
Nissei International Patent Office
Shigeru Kobayashi
Shigeru Kobayashi
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