Title:
電子デバイス、発振器及び電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP5779030
Kind Code:
B2
Abstract:
An electronic device (1) is provided in which alignment of a lid substrate (2) and a base substrate (3) is facilitated to reduce the rate of occurrence of defects. The electronic device (1) according to the invention includes a lid substrate(2), a base substrate (3) bonded to the lid substrate (2) and forming a cavity (4) hermetically sealed from the outside air between the base substrate (3) and the lid substrate (2), an electronic element (5) housed in the cavity (4), and a mold member (6a, 6b) placed on an outer face of the lid substrate (2) or the base substrate (3). Thus, warping of the lid substrate (2) or the base substrate (3) is reduced.
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Inventors:
Yoshida Yoshifumi
Application Number:
JP2011165291A
Publication Date:
September 16, 2015
Filing Date:
July 28, 2011
Export Citation:
Assignee:
Seiko Instruments Inc.
International Classes:
H03H9/02; H01L23/02; H03B5/32; H03H3/02
Domestic Patent References:
| JP2011049992A | ||||
| JP2009283553A | ||||
| JP2010187326A |
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura
Noriaki Uchino
Nobuyuki Kimura