Title:
成膜方法および電子装置の製造方法並びにマスク保持体
Document Type and Number:
Japanese Patent JP6857522
Kind Code:
B2
Abstract:
In order to suppress a film from being formed in a gap between a mask and a substrate, a technology of improving adhesion between the mask and the substrate is provided. A film-forming method includes the step of suspending a mask MK by a suspension portion HU in a state in which the suspension portion HU is supported by a supporting portion SU and the step of bringing the mask MK suspended by the suspension portion HU into contact with a glass substrate GS in the state in which the suspension portion HU is supported by the supporting portion SU.
Inventors:
Keisuke Washio
Chiba Riki
Nakao Mao
Chiba Riki
Nakao Mao
Application Number:
JP2017052836A
Publication Date:
April 14, 2021
Filing Date:
March 17, 2017
Export Citation:
Assignee:
Japan Steel Works, Ltd.
International Classes:
C23C16/04; C23C16/455; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
| JP2015199607A | ||||
| JP2006045583A | ||||
| JP3177573A | ||||
| JP2016225325A | ||||
| JP2014532304A |
Foreign References:
| WO2009069743A1 |
Attorney, Agent or Firm:
Tsutsui International Patent Office