Title:
プリント基板の加工方法
Document Type and Number:
Japanese Patent JP7441490
Kind Code:
B2
Abstract:
To solve the problem in the patent document 1(the Patent Gazette No. 6296407).SOLUTION: A processing method of a print circuit board, includes: a protective film covered step of covering a pair of protective films onto both surfaces of a base material via each copper layer, the base material in which both surface of a substrate material have the copper layer; an opening part formation step of forming each opening part having various kinds of shapes and sizes, forming an annular substance part and a plurality of connection parts extended to a radial outer direction from an outer periphery at a rotational symmetry portion of each protective film; a copper foil part removing step of removing each copper layer of the base material through various kinds of opening parts; a penetration hole formation step of forming a penetration hole by performing a sand blast processing on an exposure part of the substrate material in which each copper layer is removed from at least one of one side upper surface and one side lower surface after the copper foil part peeling step; and a protective film removing step of removing the pair of protective films remaining on the one side upper surface and the one side lower surface after that.SELECTED DRAWING: Figure 1
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| JP2003172756 | INSPECTION DEVICE OF PRINTED WIRING BOARD AND ITS INSPECTION METHOD |
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Inventors:
Hiroshi Takano
Tatsuya Ii
Osamu Wada
Hiroaki Ishiguchi
Noriyuki Okuwa
Tatsuya Ii
Osamu Wada
Hiroaki Ishiguchi
Noriyuki Okuwa
Application Number:
JP2020011050A
Publication Date:
March 01, 2024
Filing Date:
January 27, 2020
Export Citation:
Assignee:
Sagami PCI Co., Ltd.
International Classes:
H05K3/00; B23K26/382; B24C1/04
Domestic Patent References:
| JP6296407B1 | ||||
| JP2007520872A | ||||
| JP11266067A |
Attorney, Agent or Firm:
Mitsuyasu Miura
Takayuki Nagihara
Takayuki Nagihara