Document Type and Number:
Japanese Patent JPS5780834
Kind Code:
U
More Like This:
JP4827490 | Semiconductor device manufacturing system |
JPS52135267 | PACKAGING METHOD |
JPH0638423 | [Name of invention] Lead frame supply device |
Application Number:
JP15722480U
Publication Date:
May 19, 1982
Filing Date:
October 31, 1980
Export Citation:
International Classes:
H01L21/50; H01L21/60; (IPC1-7): H01L21/50; H01L21/60