Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3487940
Kind Code:
B2
Abstract:
PURPOSE: To obtain a new adhesive composition having a small change with time in an aggregating and an adhesive strengths under a high temperature or a high temperature with a high humidity, and excellent in adhesive strength on curved surfaces by blending a curing agent and a specific silicate oligomer with an acryl-based resin.
CONSTITUTION: This adhesive composition is obtained by blending (B) a curing agent (preferably, adduct of trimethylolpropane to tolylenediisocyanate) and (C) a silicate oligomer of formula I {R is H, a 1-6C alkyl, etc.; X is H or formula II [R' is (CH2)m or (CH2)k-NH-(CH2)l ((m), (k), (l) are 0-100); Y is glycidoxy, vinyl, etc.]; (n), is 1-20} with (A) an acryl-based resin. As the component (C), the oligomer of formula I in which X is formula II and Y in formula II is glycidoxy or 1,2-epoxycyclohexyl group, is preferable. Furthermore, it is preferable to blend 0.3-5 pts.wt. component B with 0.001-5 pts.wt. component C based on 100 pts.wt. component A.
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Inventors:
▲さこ▼本 泰行
Takamasa Moriyama
Kuniyasu Kato
Takamasa Moriyama
Kuniyasu Kato
Application Number:
JP2882395A
Publication Date:
January 19, 2004
Filing Date:
January 24, 1995
Export Citation:
Assignee:
Nippon Synthetic Chemical Industry Co., Ltd.
International Classes:
G02B5/30; C09J133/04; (IPC1-7): C09J133/04; G02B1/10; G02B5/30
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