Title:
ADHESIVE, ADHESIVE MEMBER, WIRING BOARD HAVING ADHESIVE MEMBER AND USED FOR PACKAGING SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE USING THE BOARD
Document Type and Number:
Japanese Patent JP2004238634
Kind Code:
A
Abstract:
To obtain an adhesive which is usable for at least three months at 25°C without deteriorating low elasticity, heat resistance and moisture resistance which are required in packaging a semiconductor chip onto a wiring board, called an interposer, such as a glass-epoxy board, a flexible board, having a thermal expansion coefficient largely differ from that of the chip.
The adhesive contains (1) 100 pts.wt. epoxy resin and its curing agent, (2) 75-300 pts.wt. epoxy group-containing acrylic copolymer containing 0.5-6 wt.% glycidyl (meth)acrylate and having a Tg (glass transition temperature) of -10°C or higher and a weight average molecular weight of at least 800,000, and (3) 0.1-20 pts.wt. latent curing accelerator.
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Inventors:
TANAKA HIROKO
INADA TEIICHI
SHIMADA YASUSHI
KURITANI HIROYUKI
KAMISHIRO YASUSHI
YAMAMOTO KAZUNORI
SUMIYA KEIJI
INADA TEIICHI
SHIMADA YASUSHI
KURITANI HIROYUKI
KAMISHIRO YASUSHI
YAMAMOTO KAZUNORI
SUMIYA KEIJI
Application Number:
JP2004105514A
Publication Date:
August 26, 2004
Filing Date:
March 31, 2004
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J133/14; C09J11/06; C09J163/00; (IPC1-7): C09J133/14; C09J11/06; C09J163/00
Domestic Patent References:
| JPH11130841A | 1999-05-18 | |||
| JPH10251610A | 1998-09-22 | |||
| JPH10137410A | 1998-05-26 | |||
| JPH10183086A | 1998-07-07 | |||
| JPH10298369A | 1998-11-10 | |||
| JP3617417B2 | 2005-02-02 |
Foreign References:
| WO1996031574A1 | 1996-10-10 |
Attorney, Agent or Firm:
Tetsuo Hotaka
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