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Title:
ADHESIVE SHEET APPLYING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP2008251791
Kind Code:
A
Abstract:

To efficiently apply the cut adhesive sheet onto a substrate with use of a plurality of pressing heads against a plurality of applying positions upon cutting an adhesive sheet bonded to one surface of a relesable sheet into a predetermined length.

An adhesive sheet applying apparatus comprises a sheet length adjusting device for adjusting an interhead sheet length between first and second pressing heads so that other one of a plurality of adhesive sheet pieces is located at a pressing application position of the second pressing head when one of the adhesive sheet pieces is located at a pressing application position of the first pressing head. The adjusting device includes an adjusting roller supported to transport a releasable sheet for adjusting the interhead sheet length by varying the position of the rotary shaft of the adjusting roller, and a sheet inverter for contacting the releasable sheet side of the adhesive sheet with the adjusting roller by inverting the front and back sides of the releasable sheet between the pressing application position and the adjusting roller.


Inventors:
MAEDA TAKESHI
UENO TETSURO
Application Number:
JP2007090591A
Publication Date:
October 16, 2008
Filing Date:
March 30, 2007
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/52; B65H23/10; B65H23/188
Domestic Patent References:
JP2003078239A2003-03-14
JP3823783B22006-09-20
JPH07287244A1995-10-31
JP2008100841A2008-05-01
Foreign References:
WO2006038384A12006-04-13
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Mitsuo Wada
Hiroshi Okabe