Title:
TOOL FOR CARRYING SUBSTRATE, COMPONENT PACKAGING METHOD, AND COMPONENT PACKAGING APPARATUS
Document Type and Number:
Japanese Patent JP2008251790
Kind Code:
A
Abstract:
To provide a tool for carrying a substrate that carries the substrate while preventing damage to the thinned substrate having a component packaging region at the edge, and to provide a component packaging method, and a component packaging apparatus.
The tool for carrying a substrate comprises: a plate member where the substrate is placed while a component packaging region arranged at the edge of the substrate is positioned outside the edge of the plate; and a substrate holding section for holding the substrate placed on the plate member with the plate member so that it can be released. The tool for carrying a substrate holds the thinned substrate for conveyance.
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Inventors:
TSUJI SHINJIRO
Application Number:
JP2007090587A
Publication Date:
October 16, 2008
Filing Date:
March 30, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/04; G09F9/00; H05K3/32
Domestic Patent References:
| JP2005202233A | 2005-07-28 | |||
| JPH11209649A | 1999-08-03 |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Mitsuo Wada
Hiroshi Okabe
Mitsuo Tanaka
Mitsuo Wada
Hiroshi Okabe