Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
接着性シート及びその製造方法
Document Type and Number:
Japanese Patent JPWO2002086004
Kind Code:
A
More Like This:
JP2005327789PRESSURE-SENSITIVE ADHESIVE SHEET FOR BOTH DICING AND DIE-BONDING, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
JP5413522Resin composition
Inventors:
Mitsuhashi Masafumi
Toshiaki Totsuka
Tomikazu Shibano
Toshihiro Tsutsui
Application Number:
JP2002003701W
Publication Date:
October 31, 2002
Filing Date:
April 12, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC Corp.
International Classes:
(IPC1-7): C09J7/02; C09J175/04
Attorney, Agent or Firm:
Origuchi Shin 5



 
Previous Patent: GRINDING MIXER

Next Patent: CHAFF GRINDING APPARATUS