Title:
粘着テープ貼付け方法および粘着テープ貼付け装置
Document Type and Number:
Japanese Patent JP7240440
Kind Code:
B2
Abstract:
To provide a pressure-sensitive adhesive tape sticking method and a pressure-sensitive adhesive tape sticking device capable of sticking a new pressure-sensitive adhesive tape accurately to the other side of a wafer having one side to which the pressure-sensitive adhesive tape has been stuck, while circumventing breakdown of the wafer or impairment of the circuit.SOLUTION: In a configuration for sticking a protective tape PT to a mount frame MF, a chamber 7 is formed by sandwiching the support tape DT of the mount frame MF. A holding table 37 for holding the protective tape PT is brought close to the support tape DT, and the distance between the protective tape PT a wafer W is maintained at D2. Internal pressure of the chamber 7 is reduced while maintaining that distance, and the protective tape PT is stuck by the differential pressure. Even if bubbles expand between the support tape DT and the wafer W and the wafer W is pressed, the wafer W can be received promptly by the holding table maintaining the contact position. Consequently, breakdown of the wafer and impairment of the circuit due to deformation of the wafer can be circumvented.SELECTED DRAWING: Figure 18
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Inventors:
Yukitoshi Hase
Shinichiro Mori
Shinichiro Mori
Application Number:
JP2021077589A
Publication Date:
March 15, 2023
Filing Date:
April 30, 2021
Export Citation:
Assignee:
NITTO DENKO CORPORATION
Nitto Seiki Co., Ltd.
Nitto Seiki Co., Ltd.
International Classes:
H01L21/683; H01L21/301
Domestic Patent References:
| JP2008153597A | ||||
| JP2011109008A | ||||
| JP2014031270A | ||||
| JP2012038880A | ||||
| JP2014049626A |
Attorney, Agent or Firm:
Tsutomu Sugitani
Hiroyuki Todaka
Tomohiko Sugiya
Kurihara Kaname
Nobuyoshi Aono
Hiroyuki Todaka
Tomohiko Sugiya
Kurihara Kaname
Nobuyoshi Aono