Title:
APPLICATOR FOR BOND
Document Type and Number:
Japanese Patent JP3585590
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an applicator for bond in which a nozzle for applying bond for bonding electronic parts to a substrate can simply and promptly be replaced.
SOLUTION: A nozzle 23 is set at the lower end of a syringe 21 and inserted into a rotary body 25, and its flange 24 is landed on the flange 25a of the rotary body 25. An engagement body 40 which is sprung by a spring material 45 is on the flange 25a, and its projection 42 is joined to the upper surface of the flange 24 to fix the nozzle 23. When pushed by a finger, the engagement body 40 slides, and the projection 42 is separated from the flange 24. By pulling up the syringe 21, the syringe and the nozzle 23 are removed integrally from a syringe holder 49. After the nozzle 23 being replaced, by inserting the nozzle 23 and the syringe 21 into the syringe holder from above, the projection 42 of the engagement body 40 is joined to the upper surface of the flange 24 to fix the nozzle 23.
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Inventors:
Narutaka Abe
Application Number:
JP21028295A
Publication Date:
November 04, 2004
Filing Date:
August 18, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B05C5/00; H05K13/04; (IPC1-7): B05C5/00; H05K13/04
Domestic Patent References:
| JP6106118A | ||||
| JP6112638A | ||||
| JP5154428A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito