Title:
BONDING DEVICE FOR ELECTRODE MATERIAL AND BONDING METHOD FOR ELECTRODE MATERIAL
Document Type and Number:
Japanese Patent JP2018085206
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress defective bonding between electrode materials due to abrasive grains.SOLUTION: A bonding device for electrode materials includes an injection unit 51 and a junction. The injection unit 51 removes a portion located at one end of each electrode material in the longitudinal direction in an active material mixture layer by injecting abrasive grains of conductive metal. The junction bonds exposed portions together formed to the electrode materials by removing the active material mixture layer.SELECTED DRAWING: Figure 2
Inventors:
YAMAUCHI KAZUTERU
KINOSHITA KYOICHI
KINOSHITA KYOICHI
Application Number:
JP2016227034A
Publication Date:
May 31, 2018
Filing Date:
November 22, 2016
Export Citation:
Assignee:
TOYOTA IND CORP
International Classes:
B23K1/00; B23K1/20; B23K11/00; B23K11/34; B24C1/00; B24C11/00; H01G11/84; H01G11/86; H01G13/00; H01M4/04; H01M4/139
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
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