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Title:
CIRCUIT DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008187144
Kind Code:
A
Abstract:

To provide a circuit device in which a structure for sealing a hybrid IC provided on the upper surface of a circuit substrate is simplified, and to provide its manufacturing method.

The hybrid IC device 10 comprises a circuit substrate 11 having a peripheral portion 12 formed flatly and a recess 36 depressed in the thickness direction, an insulating layer 20 formed on the bottom 14 of the recess 36, a hybrid IC composed of a conductive pattern 22 and a circuit element 24 formed on the surface of the insulating layer 20, and a lead 28 bonded to a pad 26 composed of the conductive pattern 22 and led out of the recess 36 of the circuit substrate 11.


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Inventors:
SAITO HIDESHI
TAKAKUSAKI SADAMICHI
SAKAMOTO NORIAKI
Application Number:
JP2007021811A
Publication Date:
August 14, 2008
Filing Date:
January 31, 2007
Export Citation:
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Assignee:
SANYO ELECTRIC CO
SANYO SEMICONDUCTOR CO LTD
International Classes:
H01L25/04; H01L25/18
Domestic Patent References:
JPH11204904A1999-07-30
JPH0964580A1997-03-07
JPH07326708A1995-12-12
JPS62109417A1987-05-20
JPS6381954A1988-04-12
JPH07202475A1995-08-04
JP2001244127A2001-09-07
JPH0730215A1995-01-31
JPH0722720A1995-01-24
JPS59198793A1984-11-10
JPS605589A1985-01-12
JPS61270152A1986-11-29
JPS61166560U1986-10-16
JPS6390875U1988-06-13
Attorney, Agent or Firm:
Takashi Okada



 
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