CMP POLISHING PAD WITH ENHANCED POLISHING RATE - ROHM & HAAS ELECTRONIC MAT CMP HOLDINGS INC

Title:

CMP POLISHING PAD WITH ENHANCED POLISHING RATE

Document Type and Number:

Japanese Patent JP2022159069

Kind Code:

A

Abstract:

To provide means of improving, preferably without increasing defects, a removal rate important to efficiency of a process of making an electronic device.SOLUTION: In chemical mechanical polishing, a polishing pad having a polishing portion comprising a polymer matrix and rate enhancing lamellar particles that include a phosphate or arsenate of a group III-A or IV-A metal can be effective in chemical mechanical polishing especially when using slurry comprising particles having a positive charge in slurry conditions.SELECTED DRAWING: Figure 1

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Inventors:

MOHAMMAD T ISLAM

Application Number:

JP2022049560A

Publication Date:

October 17, 2022

Filing Date:

March 25, 2022

Export Citation:

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Assignee:

ROHM & HAAS ELECTRONIC MAT CMP HOLDINGS INC

International Classes:

B24B37/24; B24B37/00; H01L21/304

Attorney, Agent or Firm:

Patent Attorney Corporation Tsukuni

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