COMPONENT MOUNTING STRUCTURE FOR BOARD

Title:

COMPONENT MOUNTING STRUCTURE FOR BOARD

Document Type and Number:

Japanese Patent JP2001015554

Kind Code:

A

Abstract:

To implement a structure wherein capillary phenomenon is improved by providing particularly a portion, where no bumps of components and lands of a board are formed, with dummy projections or the like equivalent to the bumps of the components in order to prevent the occurrence of air bubbles and uneven filling of an insulating resin when portions for soldering the components and the board are filled with the insulating resin.

This component mounting structure is such that a board 3 has a land mounting region where a plurality of lands 4 are provided for electrical connection with a plurality of bumps 2 of a component 1. A land non- mounted region 50 other than the land mounting region, where lands 4 are not provided, is provided with a silk-screened film equivalent to the lands 4, whereby a clearance between a CSP(chip size package) 1 and the board 3 is filled with an insulating resin 7 satisfactorily.

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Inventors:

MORI SHIGERU
NARUI JOSHI
ISHII TSUGUHISA
INOUE NORIHIRO

Application Number:

JP18657999A

Publication Date:

January 19, 2001

Filing Date:

June 30, 1999

Export Citation:

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Assignee:

FUJITSU TEN LTD

International Classes:

H05K1/18; H01L21/56; H01L21/60; (IPC1-7): H01L21/60; H05K1/18

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