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Title:
CONDUCTIVE ADHESIVE COMPOSITION AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022096219
Kind Code:
A
Abstract:
To provide a conductive adhesive composition that can give a cured product that has high flexibility and durability sufficient to withstand repeated bending, and shows a low specific resistance value even when repeatedly bent, offering high conductivity, and to provide such a cured product as well as an electronic component.SOLUTION: A conductive adhesive composition contains a monofunctional urethane methacrylate and conductive particles. The monofunctional urethane methacrylate is at least one monomer selected from reactants of compounds including a predetermined (meth)acryloyloxy group.SELECTED DRAWING: None

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Inventors:
NAKAMURA MAKIHITO
SUZUKI KAZUTOSHI
Application Number:
JP2020209198A
Publication Date:
June 29, 2022
Filing Date:
December 17, 2020
Export Citation:
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Assignee:
AGC INC
International Classes:
C09J175/08; C09J9/02; C09J11/02
Attorney, Agent or Firm:
Otani patent office



 
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