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Title:
CONDUCTIVE COMPOSITION FOR COATING PLASTICS
Document Type and Number:
Japanese Patent JPH06179839
Kind Code:
A
Abstract:

PURPOSE: To provide a conductive composition for surface coating which can give a coating film excellent in contour following properties, conductivity and blocking resistance.

CONSTITUTION: The conductive composition comprises a mixture of an aqueous solution or emulsion of a thermoplastic resin (1), a wax emulsion (2) and a conductive carbon (3), wherein the weight ratio of the solid matter of (1) to that of (2) is 98:2-50:50, and the weight ratio of the total of the solid matters of (1) and (2) to that of (3) is 95:5-50:50, or wherein component (3) is a conductive metal compound, and the weight ratio of the total of the solid matters of (1) and (2) to that of (3) is 75:25-40:60.


Inventors:
TANAKA KIYOBUMI
KITAOKA HIROSHI
Application Number:
JP10202192A
Publication Date:
June 28, 1994
Filing Date:
March 27, 1992
Export Citation:
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Assignee:
SHINETSU POLYMER CO
International Classes:
C08J3/215; C08J5/18; C08J7/04; C09D5/00; C09D5/02; C09D5/24; H01B1/22; H01B1/24; (IPC1-7): C09D5/24; C08J3/215; C09D5/02
Domestic Patent References:
JPH01246708A1989-10-02
JPS5171345A1976-06-21
JPS63143706A1988-06-16
Attorney, Agent or Firm:
Ryoichi Yamamoto (1 person outside)