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Patent Searching and Data


Title:
CONDUCTIVE MATERIAL AND CONDUCTOR USING IT
Document Type and Number:
Japanese Patent JP2016145299
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide conductive material capable of providing conducting substance at a low temperature and a conductor produced with the conductive material obtained by the present invention.SOLUTION: There is provided a conductive material containing a copper containing particle in which alkylamine is used as a protecting agent, organic solvent and fatty acid A. It is preferable that the fatty acid A contains at least one fatty acid having 9 or less of carbon atoms. It is preferable that the fatty acid A is contained at 0.01 to 40.0 parts by mass relatively to 100 parts by mass of the copper containing particle. It is preferable that the copper containing particle in which alkylamine is used as a protecting agent is one obtained by a step of heating a mixture of a salt compound of fatty acid B and copper (fatty acid copper), a reducing compound and alkylamine. It is preferable that the reducing compound comprises at least one compound selected from a group consisting of hydrazine, hydrazine derivative, hydroxylamine and hydroxylamine derivative. There is also provided a conductor obtained by heating the conductive material at 250°C or less.SELECTED DRAWING: None

Inventors:
YONEKURA GENKI
URASHIMA KOSUKE
KAMISHIRO YASUSHI
Application Number:
JP2015023190A
Publication Date:
August 12, 2016
Filing Date:
February 09, 2015
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09D11/52; B22F1/00; B22F1/02; B22F9/00; B22F9/24; H01B1/00; H01B1/22; H01B5/14
Domestic Patent References:
JP2013001966A2013-01-07
JP2013007076A2013-01-10
JP2014148732A2014-08-21
JP2011061208A2011-03-24
Foreign References:
WO2013147442A12013-10-03
WO2013147535A12013-10-03
WO2013096664A12013-06-27